Our Transfer and Compression Melamines provide a resin system best suited for use in the removal of mold stain which accumulated during the use of Epoxy Molding Compound for Encapsulation of Semiconductors.
Our Melamine consists of +65% of Resin Polymer, +25% of Filler, +1% of Coupling Agent to increase the Binding between Organic and Mineral Material, +1% of Catalyst to increase Reaction Speed and +1% of Wax.
Our Grades are as below Table:
Our Melamine uses the following Parameters:
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